Package on-package devices with upper RDL of WLPS and methods therefor

US9991235B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Min Tao · San Jose, US
• Hoki Kim · Hopewell Junction, US
• Ashok S. Prabhu · San Jose, US
• Zhuowen Sun · Campbell, US
• Wael Zohni · San Jose, US
• Belgacem Haba · Cupertino, US

Key dates

• Filing date: Dec 28, 2016
• Grant date: Jun 5, 2018
• Expiry date: Dec 28, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Package-on-package (“PoP”) devices with upper RDLs of WLP (“WLP”) components and methods therefor are disclosed. In a PoP device, a first IC die is surface mount coupled to an upper surface of the package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region with reference to the first IC. A molding layer is formed over the upper surface of the package substrate. A first and a second WLP microelectronic component is located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. Each of the first and the second WLP microelectronic components have a second IC die located below a first RDL respectively thereof. A third and a fourth IC die are respectively surface mount coupled over the first and the second WLP microelectronic components.