Patent · US Active

Method and apparatus for wafer wet processing

US9997379B2 · kind B2 · utility

0Cited by

8References

6Claims

0Family size

Assignee

Lam Research Corporation · US

Inventors

Harald Kraus · Leverkusen, DE
Marco Nardoni · Villach, AT
Michael Brugger · Seeboden, AT

Key dates

Filing date	Nov 30, 2010
Grant date	Jun 12, 2018
Priority date	—
Expiry date	Aug 28, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67051
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A gas dispenser in a process module for wet processing of wafer-shaped articles is substantially smaller than the article to be processed and is movable laterally of the article as it dispenses inert gas above the article.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.