Semiconductor device having a barrier layer made of amorphous molybdenum nitride and method for producing such a semiconductor device
US9997459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2017 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Feb 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor body having a front face, a back face and an active zone at the front face. A front surface metallization layer having a front face and a back face is disposed over the semiconductor body so that the back face of the front surface metallization layer faces the front face of the semiconductor body and is electrically connected to the active zone. An upper barrier layer made of amorphous molybdenum nitride is disposed on the front face of the front surface metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.