Coated bond wires for die packages and methods of manufacturing said coated bond wires
US9997489B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2014 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Jul 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond wire having a metal core, a dielectric layer, and a ground connectable metallization, wherein the bond wire has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one bond wire according to the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.