Power module with improved reliability
US9998109B1 · kind B1 · utility
5Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2017 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | May 15, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.