Grounding ring of a process kit for semiconductor substrate processing

USD1064005S1 · kind S1 · design

Assignee

• Applied Materials, Inc. · US

Inventors

• Abhishek Chowdhury · Kanchinakote, IN
• Nataraj Bhaskar Rao · Kanchinakote, IN
• Edwin C. Suarez · Pleasanton, US
• Harisha Sathyanarayana · Kanchinakote, IN
• Diego Ramiro Puente Sotomayor · Phoenix, US
• Qanit Takmeel · Latham, US
• Mohammad Kamruzzaman Chowdhury · Santa Clara, US
• Arun Chakravarthy Chakravarthy · Komangalam, IN

Key dates

• Filing date: Aug 4, 2022
• Grant date: Feb 25, 2025
• Expiry date: Feb 25, 2040

Classification

• Technology area (CPC —): General