Heat dissipation deterrence link for semiconductor manufacture
USD588079S1 · kind S1 · design
1Cited by
10References
1Claims
0Family size
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Key dates
| Filing date | Dec 15, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Mar 10, 2023 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.