Elastic membrane for semiconductor wafer polishing apparatus
USD633452S1 · kind S1 · design
325Cited by
23References
1Claims
0Family size
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Key dates
| Filing date | Feb 25, 2010 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Mar 1, 2025 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.