Electroplating flow shaping plate having offset spiral hole pattern
USD648289S1 · kind S1 · design
47Cited by
22References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2010 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Nov 8, 2025 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.