Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 · kind S1 · design
17Cited by
20References
1Claims
0Family size
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Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Jan 23, 2033 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.