Microwave plasma processing process and apparatus
USRE36224E · kind E · reissue
1Cited by
11References
31Claims
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Key dates
| Filing date | Nov 15, 1996 |
| Grant date | Jun 8, 1999 |
| Priority date | — |
| Expiry date | Nov 15, 2016 |
Classification
- Technology area (CPC —)General
Abstract
A microwave plasma processing process and apparatus useful in the fabrication of integrated circuit (IC) or similar semiconductor devices, wherein the object or material to be processed, such as a semiconductor wafer, is processed with plasma generated using microwaves transmitted through a microwave transmission window disposed perpendicular to an electric field of the progressive microwaves in the waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.