Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
USRE41889E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC —)General
Abstract
A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.