Thin multi-chip flex module
USRE42252E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2010 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC —)General
Abstract
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.