Stackable layer containing ball grid array package
USRE43536E1 · kind E1 · reissue
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29References
35Claims
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Key dates
| Filing date | Jul 9, 2009 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Jul 9, 2029 |
Classification
- Technology area (CPC —)General
Abstract
Layers suitable for stacking in three dimensional, multilayer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are underfilled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.