ASemiconductor, Inc.
7Patents
0Active
7Granted
28Portfolio score
Filing activity: Dec 11, 1996 → Jan 29, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5872399A | Solder ball land metal structure of ball grid semiconductor package | Emerging Cross-Sectional Technologies | 176 | Expired |
| US5905633A | Ball grid array semiconductor package using a metal carrier ring as a heat spreader | Electricity | 70 | Expired |
| US5858815A | Semiconductor package and method for fabricating the same | Electricity | 52 | Expired |
| US6020218A | Method of manufacturing ball grid array semiconductor package | Electricity | 42 | Expired |
| US6214645A | Method of molding ball grid array semiconductor packages | Electricity | 32 | Expired |
| US5977624A | Semiconductor package and assembly for fabricating the same | Electricity | 21 | Expired |
| US6090715A | Masking process for forming self-aligned dual wells or self-aligned field-doping regions | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.