Dense-Pac Microsystems, Inc.
8Patents
0Active
8Granted
31Portfolio score
Filing activity: Nov 4, 1988 → Jul 24, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4956694A | Integrated circuit chip stacking | Electricity | 322 | Expired |
| US6404043B1 | Panel stacking of BGA devices to form three-dimensional modules | Electricity | 235 | Expired |
| US5612570A | Chip stack and method of making same | Electricity | 192 | Expired |
| US5313096A | IC chip package having chip attached to and wire bonded within an overlying substrate | Electricity | 146 | Expired |
| US5869353A | Modular panel stacking process | Electricity | 135 | Expired |
| US6323060A | Stackable flex circuit IC package and method of making same | Electricity | 114 | Expired |
| US6627984B2 | Chip stack with differing chip package types | Electricity | 83 | Expired |
| US6222737A | Universal package and method of forming the same | Emerging Cross-Sectional Technologies | 83 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.