Planar Solutions, LLC
5Patents
3Active
5Granted
37Portfolio score
Filing activity: Oct 9, 2002 → Aug 5, 2010 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6749488B2 | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers | Electricity | 9 | Expired |
| US8303806B2 | Fluid processing | Performing Operations; Transporting | 8 | Active |
| US6776696B2 | Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers | Electricity | 5 | Expired |
| US8961815B2 | Composition for advanced node front-and back-end of line chemical mechanical polishing | Electricity | 1 | Active |
| US8974677B2 | Fluid processing | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.