Tezzaron Semiconductor, Inc.
5Patents
4Active
5Granted
43Portfolio score
Filing activity: Apr 21, 2004 → Jan 11, 2011 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8183127B2 | Method for bonding wafers to produce stacked integrated circuits | Electricity | 213 | Active |
| US7750488B2 | Method for bonding wafers to produce stacked integrated circuits | Electricity | 199 | Active |
| US7898095B2 | Fiducial scheme adapted for stacked integrated circuits | Electricity | 20 | Active |
| US7159047B2 | Network with programmable interconnect nodes adapted to large integrated circuits | Electricity | 8 | Expired |
| US8222121B2 | Fiducial scheme adapted for stacked integrated circuits | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.