United Electronics Corp.
3Patents
0Active
3Granted
25Portfolio score
Filing activity: Jan 28, 2002 → Sep 1, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6881654B2 | Solder bump structure and laser repair process for memory device | Electricity | 13 | Expired |
| US6489196B1 | Method of forming a capacitor with high capacitance and low voltage coefficient | Electricity | 4 | Expired |
| US7063923B2 | Optical proximity correction method | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.