Unitive Electronics Inc.
5Patents
0Active
5Granted
29Portfolio score
Filing activity: May 23, 2000 → Feb 17, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6492197B1 | Trilayer/bilayer solder bumps and fabrication methods therefor | Electricity | 75 | Expired |
| US6418033B1 | Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles | Electricity | 43 | Expired |
| US7081404B2 | Methods of selectively bumping integrated circuit substrates and related structures | Electricity | 29 | Expired |
| US6666368B2 | Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7032806B2 | Methods of positioning components using liquid prime movers and related structures | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.