Aminuddin Ismail
3Patents
3h-index
9Co-inventors
36Inventor score
Filing activity: Oct 31, 2005 → Jun 8, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7554185B2 | Flip chip and wire bond semiconductor package | Electricity | 17 | Expired |
| US7432130B2 | Method of packaging semiconductor die without lead frame or substrate | Electricity | 5 | Active |
| US8643172B2 | Heat spreader for center gate molding | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.