Heat spreader for center gate molding
US8643172B2 · kind B2 · utility
3Cited by
20References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Oct 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader for an integrated circuit has a base portion and a top portion. The base portion is attachable to a surface of the integrated circuit, and has at least one channel extending therethrough. The top portion that is larger than the base portion such that the heat spreader is generally T-shaped in cross-section. The top portion has a hole at its center that extends from a top surface of the top portion to the at least one channel of the base portion. Mold compound is injected through the hole and out through the channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.