Andreas Roemer
3Patents
1h-index
4Co-inventors
27Inventor score
Filing activity: Jun 26, 2002 → Mar 5, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6932674B2 | Method of determining the endpoint of a planarization process | Performing Operations; Transporting | 2 | Expired |
| US6827635B2 | Method of planarizing substrates | Performing Operations; Transporting | 0 | Expired |
| US6858449B2 | Process and device for the abrasive machining of surfaces, in particular semiconductor wafers | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.