Patent · US Expired

Method of planarizing substrates

US6827635B2 · kind B2 · utility

0Cited by

8References

35Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Lahnor · Dresden, DE
Olaf Kuehn · Suhl, DE
Andreas Roemer · Dresden, DE
Alexander William Simpson · Wappingers Falls, US

Key dates

Filing date	Mar 5, 2003
Grant date	Dec 7, 2004
Priority date	—
Expiry date	Mar 5, 2023

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/245
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method and apparatus of planarizing substrates is disclosed. A planarizing web medium is prepared for planarizing substrates to reduce defect generation. The planarizing web has a planarizing region and preparing region defined thereon, wherein at least one portion of the preparing region is outside the planarizing region. The web medium is advanced to move one portion of the web out of the planarizing region and another portion into the planarizing region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.