Ann McDonald
6Patents
4h-index
26Co-inventors
46Inventor score
Filing activity: Jan 15, 2002 → May 27, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6737747B2 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Electricity | 23 | Expired |
| US6887783B2 | Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof | Electricity | 13 | Expired |
| US6939797B2 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | Electricity | 11 | Expired |
| US6914320B2 | Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof | Electricity | 8 | Expired |
| US7179760B2 | Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same | Electricity | 1 | Expired |
| US7034400B2 | Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.