Arno Zechmann
5Patents
3h-index
14Co-inventors
46Inventor score
Filing activity: Apr 6, 2012 → Sep 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9660037B1 | Semiconductor wafer and method | Electricity | 35 | Active |
| US8502274B1 | Integrated circuit including power transistor cells and a connecting line | Electricity | 10 | Active |
| US10256149B2 | Semiconductor wafer dicing crack prevention using chip peripheral trenches | Electricity | 3 | Active |
| US9425090B2 | Method of electrodepositing gold on a copper seed layer to form a gold metallization structure | Electricity | 0 | Active |
| US10903120B2 | Semiconductor wafer dicing crack prevention using chip peripheral trenches | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.