Inventor · Regensburg, DE

Benjamin Michaelis

3Patents
0h-index
5Co-inventors
21Inventor score

Filing activity: Dec 19, 2018 → Jun 27, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US12100791B2 Method for producing a semiconductor component having an insulating substrate, and semiconductor component having an insulating substrate Electricity 0 Active
US11227977B2 Optoelectronic semiconductor device Electricity 0 Active
US11705370B2 Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layer Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.