Bernd Hupfer
5Patents
3h-index
4Co-inventors
39Inventor score
Filing activity: May 4, 1987 → Mar 11, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5021320A | Polyamide containing the hexafluoroisopropylidene group with O-quinone diazide in positive working photoresist | Chemistry; Metallurgy | 27 | Expired |
| US5077378A | Polyamide containing the hexafluoroisopropylidene group | Chemistry; Metallurgy | 24 | Expired |
| US5240819A | Polyamide containing the hexafluoroisopropylidene group and process of using to form a positive image | Emerging Cross-Sectional Technologies | 10 | Expired |
| US4871833A | Polyamic acids, polyimides prepared from these and process for producing high-temperature resistant layers | Chemistry; Metallurgy | 3 | Expired |
| US5198325A | Photopolymerizable mixture, copying material containing same and process for producing highly heat-resistant relief structures wherein a trihalomethyl is the photoinitiator | Physics | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.