Bernhard Drummer
4Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Dec 10, 2015 → Oct 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9570352B2 | Method of dicing a wafer and semiconductor chip | Electricity | 2 | Active |
| US10029913B2 | Removal of a reinforcement ring from a wafer | Performing Operations; Transporting | 0 | Active |
| US9911655B2 | Method of dicing a wafer and semiconductor chip | Electricity | 0 | Active |
| US12374632B2 | Semiconductor device and method for manufacturing a plurality of semiconductive devices | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.