Berthold Michelt
5Patents
4h-index
5Co-inventors
42Inventor score
Filing activity: Jan 10, 2011 → May 5, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9494409B2 | Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer | Physics | 11 | Active |
| US8716039B2 | Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatus | Electricity | 9 | Active |
| US9500471B2 | Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object | Physics | 8 | Active |
| US9677871B2 | Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head | Physics | 7 | Active |
| US9982994B2 | Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head | Physics | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.