Brian G. Anthony
6Patents
5h-index
23Co-inventors
59Inventor score
Filing activity: Mar 2, 1999 → Sep 26, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713381B2 | Method of forming semiconductor device including interconnect barrier layers | Electricity | 73 | Expired |
| US6274478A | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Electricity | 36 | Expired |
| US6444569B1 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Electricity | 31 | Expired |
| US6451181B1 | Method of forming a semiconductor device barrier layer | Electricity | 17 | Expired |
| US6573173B2 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Electricity | 10 | Expired |
| US10446436B2 | In-line protection from process induced dielectric damage | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.