Chi-Hsin Chiu
13Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Apr 28, 2010 → Apr 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8420430B2 | Fabrication method of package structure having MEMS element | Electricity | 15 | Active |
| US9520304B2 | Semiconductor package and fabrication method thereof | Electricity | 4 | Active |
| US11676948B2 | Method for fabricating electronic package | Electricity | 3 | Active |
| US11056470B2 | Electronic package and method for fabricating the same | Electricity | 2 | Active |
| US8716070B2 | Fabrication method of package structure having MEMS element | Electricity | 2 | Active |
| US8866236B2 | Package structure having MEMS element | Electricity | 1 | Active |
| US9991178B2 | Interposer and electrical testing method thereof | Electricity | 1 | Active |
| US8520391B2 | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US10615055B2 | Method for fabricating package structure | Electricity | 0 | Active |
| US9254994B2 | Package structure having MEMS element | Electricity | 0 | Active |
| US12176327B2 | Method for fabricating electronic package | Electricity | 0 | Active |
| US10950507B2 | Electrical testing method of interposer | Electricity | 0 | Active |
| US10199239B2 | Package structure and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.