Manufacturing method of package structure having conductive shield
US10276510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2017 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Sep 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.