Chunhai Ji
7Patents
4h-index
17Co-inventors
43Inventor score
Filing activity: May 17, 2013 → May 1, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9023731B2 | Carbon deposition-etch-ash gap fill process | Electricity | 26 | Active |
| US9362133B2 | Method for forming a mask by etching conformal film on patterned ashable hardmask | Electricity | 14 | Active |
| US9644271B1 | Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabrication | Electricity | 12 | Active |
| US9589799B2 | High selectivity and low stress carbon hardmask by pulsed low frequency RF power | Electricity | 6 | Active |
| US10192759B2 | Image reversal with AHM gap fill for multiple patterning | Electricity | 2 | Active |
| US10475627B2 | Carrier ring wall for reduction of back-diffusion of reactive species and suppression of local parasitic plasma ignition | Electricity | 0 | Active |
| US9941113B2 | Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabrication | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.