Thermal processor
US6030208A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1998 |
| Grant date | Feb 29, 2000 |
| Priority date | — |
| Expiry date | Jun 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67775
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processor for treating a plurality of semiconductor articles introduced into the processor and pods includes a work-in-process stocker and furnace combination. The stocker includes a loading port, shelves for storing pods and a loadport. The loadport includes a pod opener and is positioned at a port through to the furnace housing. The pod opener may be an indexer for an SMIF pod or a FOUP loadport for handling a 300 mm. wafer pod. A manipulator within the stocker operates to receive and output pods from the processor, present pods to the loadport for loading and unloading and warehousing pods between such operations. In one embodiment, the manipulator operates in an X-axis, Y-axis horizontal plane as well as in a Z-axis direction and rotation about the Z-axis. In the other, the Y-axis degree of freedom is eliminated. The cooperating furnace includes a preload wafer station and a cooling wafer station in combination with a double lift furnace having a process container and a furnace heating element assembly which can be lowered independently for processing. An end effector within the furnace housing cooperates with the stocker as well as with the furnace for most efficient…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.