Daniel A. Koos
11Patents
10h-index
10Co-inventors
65Inventor score
Filing activity: Jan 6, 1994 → May 26, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5413941A | Optical end point detection methods in semiconductor planarizing polishing processes | Physics | 270 | Expired |
| US5934980A | Method of chemical mechanical polishing | Electricity | 182 | Expired |
| US6234877A | Method of chemical mechanical polishing | Electricity | 118 | Expired |
| US6120354A | Method of chemical mechanical polishing | Electricity | 109 | Expired |
| US6099604A | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto | Electricity | 70 | Expired |
| US7338908B1 | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage | Electricity | 36 | Expired |
| US6312486A | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto | Electricity | 25 | Expired |
| US5741547A | Method for depositing a film of titanium nitride | Chemistry; Metallurgy | 20 | Expired |
| US7531463B2 | Fabrication of semiconductor interconnect structure | Electricity | 19 | Active |
| US7972970B2 | Fabrication of semiconductor interconnect structure | Electricity | 15 | Active |
| US8481432B2 | Fabrication of semiconductor interconnect structure | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.