Daniel A. Steigerwald
10Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Dec 15, 2006 → Dec 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7736945B2 | LED assembly having maximum metal support for laser lift-off of growth substrate | Electricity | 23 | Active |
| US8400064B2 | Zener diode protection network in submount for LEDs connected in series | Emerging Cross-Sectional Technologies | 6 | Active |
| US8384118B2 | LED assembly having maximum metal support for laser lift-off of growth substrate | Electricity | 3 | Active |
| US8062916B2 | Series connected flip chip LEDs with growth substrate removed | Electricity | 3 | Active |
| US8471282B2 | Passivation for a semiconductor light emitting device | Electricity | 3 | Active |
| US10134965B2 | Passivation for a semiconductor light emitting device | Electricity | 2 | Active |
| US10134964B2 | Passivation for a semiconductor light emitting device | Electricity | 1 | Active |
| US10873013B2 | Passivation for a semiconductor light emitting device | Electricity | 0 | Active |
| US11658273B2 | Passivation for a semiconductor light emitting device | Electricity | 0 | Active |
| US8450754B2 | Series connected flip chip LEDs with growth substrate removed | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.