Daniel Schleisser
3Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: May 24, 2017 → Jan 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9978672B1 | Transistor package with terminals coupled via chip carrier | Electricity | 5 | Active |
| US10319671B2 | Semiconductor package with leadframe | Electricity | 1 | Active |
| US11183445B2 | Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.