Debashish Basu
4Patents
1h-index
16Co-inventors
37Inventor score
Filing activity: Sep 30, 2017 → Oct 27, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11145541B2 | Conductive via and metal line end fabrication and structures resulting therefrom | Electricity | 3 | Active |
| US11211324B2 | Via contact patterning method to increase edge placement error margin | Electricity | 0 | Active |
| US12368095B2 | Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization | Electricity | 0 | Active |
| US11652045B2 | Via contact patterning method to increase edge placement error margin | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.