Donghoon Won
7Patents
1h-index
14Co-inventors
40Inventor score
Filing activity: Dec 21, 2017 → Oct 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10418335B2 | Substrate, method of sawing substrate, and semiconductor device | Electricity | 2 | Active |
| US11721669B2 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Electricity | 1 | Active |
| US11469180B2 | Semiconductor device including an insulating material layer with concave-convex portions | Electricity | 1 | Active |
| US10916509B2 | Substrate, method of sawing substrate, and semiconductor device | Electricity | 1 | Active |
| US11935832B2 | Semiconductor device and method of fabricating the same | Electricity | 0 | Active |
| US12406888B2 | Semiconductor substrate and method of dicing the same | Electricity | 0 | Active |
| US11932715B2 | Hardmask composition and method of forming patterns | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.