Dongkyun Ko
9Patents
2h-index
20Co-inventors
47Inventor score
Filing activity: Mar 31, 2009 → Feb 25, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8093690B2 | Chip package and manufacturing method thereof | Electricity | 53 | Active |
| US8592958B2 | Chip package and manufacturing method thereof | Electricity | 9 | Active |
| US10573851B2 | Apparatus for manufacturing display apparatus and method of manufacturing display apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
| US10043998B2 | Method of manufacturing the display apparatus including first inorganic layer and second inorganic layer | Electricity | 0 | Active |
| US12025243B2 | Refrigerant pipe fitting and refrigerant pipe fitting method using thereof | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11186908B2 | Apparatus and method of manufacturing display apparatus | Electricity | 0 | Active |
| US12207530B2 | Apparatus for manufacturing display apparatus and method of manufacturing display apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US10041173B2 | Apparatus and method of manufacturing display apparatus | Electricity | 0 | Active |
| US9587311B2 | Display apparatus including a thin film encapsulation layer and apparatus for and method of manufacturing the display apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.