Emiko Kawamura
41Patents
1h-index
17Co-inventors
43Inventor score
Filing activity: Apr 4, 2019 → Oct 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10847420B2 | Wafer processing method | Electricity | 2 | Active |
| US11062948B2 | Wafer processing method | Electricity | 1 | Active |
| US11289379B2 | Wafer processing method | Electricity | 1 | Active |
| US11037814B2 | Wafer processing method using a ring frame with a polyester sheet with no adhesive layer | Electricity | 1 | Active |
| US10991624B2 | Wafer processing method including applying a polyolefin sheet to a wafer | Electricity | 1 | Active |
| US11610815B2 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US10896850B2 | Wafer processing method | Electricity | 0 | Active |
| US11049772B2 | Wafer processing method including applying a polyester sheet to a wafer | Electricity | 0 | Active |
| US11545393B2 | Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer | Electricity | 0 | Active |
| US11476161B2 | Wafer processing method including applying a polyolefin sheet to a wafer | Electricity | 0 | Active |
| US10998232B2 | Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet | Electricity | 0 | Active |
| US11380588B2 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Electricity | 0 | Active |
| US11361997B2 | Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer | Electricity | 0 | Active |
| US11031234B2 | Wafer processing method including applying a polyolefin sheet to a wafer | Electricity | 0 | Active |
| US11127633B2 | Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet | Electricity | 0 | Active |
| US11018043B2 | Wafer processing method using a ring frame and a polyester sheet | Electricity | 0 | Active |
| US11024543B2 | Wafer processing method including applying a polyester sheet to a wafer | Electricity | 0 | Active |
| US11322407B2 | Wafer processing method including applying a polyester sheet to a wafer | Electricity | 0 | Active |
| US11587832B2 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Electricity | 0 | Active |
| US10985066B2 | Wafer processing method for dividing a wafer along division lines | Electricity | 0 | Active |
| US11302578B2 | Wafer processing method | Electricity | 0 | Active |
| US10910269B2 | Wafer processing method | Electricity | 0 | Active |
| US10720355B2 | Wafer processing method | Electricity | 0 | Active |
| US11056334B2 | Wafer processing method using a ring frame and a polyester sheet | Electricity | 0 | Active |
| US11393721B2 | Wafer processing method | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.