Wafer processing method including applying a polyolefin sheet to a wafer
US11031234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Nov 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip through the polyolefin sheet to push up each device chip, thereby picking up each device chip from the polyolefin sheet after performing the dividing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.