Wafer processing method using a ring frame and a polyester sheet
US11056334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Nov 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip through the polyester sheet to push up each device chip, thereby picking up each device chip from the polyester sheet after performing the dividing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.