Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer

USRE40139E1 · kind E1 · reissue

Assignee

• Renesas Technology Corporation · JP

Inventors

• Hisashi Maejima · Tokyo, JP
• Hiroshi Nishizuka · Kodaira, JP
• Susumu Komoriya · Yamakita, JP
• Etuo Egashira · Yamanashi, JP

Key dates

• Filing date: Nov 3, 2000
• Grant date: Mar 4, 2008
• Expiry date: Nov 3, 2020

Classification

• Technology area (CPC —): General

Abstract

A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epiaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.