Fan Yeung
4Patents
3h-index
7Co-inventors
36Inventor score
Filing activity: Mar 31, 2008 → Jun 28, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7670939B2 | Semiconductor chip bump connection apparatus and method | Electricity | 55 | Active |
| US8779598B2 | Method and apparatuses for integrated circuit substrate manufacture | Electricity | 4 | Active |
| US7646083B2 | I/O connection scheme for QFN leadframe and package structures | Electricity | 3 | Active |
| US8378471B2 | Semiconductor chip bump connection apparatus and method | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.