Feng Lin
7Patents
4h-index
9Co-inventors
46Inventor score
Filing activity: Feb 20, 2001 → Dec 2, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6458617B1 | Multi-chip semiconductor package structure | Electricity | 27 | Expired |
| US9027969B2 | Pipe quick release structure | Mechanical Engineering; Lighting; Heating | 7 | Active |
| US9772040B2 | Faucet with two outlets | Emerging Cross-Sectional Technologies | 5 | Active |
| US6844616B2 | Multi-chip semiconductor package structure | Electricity | 5 | Expired |
| US6872619B2 | Semiconductor device having trench top isolation layer and method for forming the same | Electricity | 3 | Expired |
| US7144799B2 | Method for pre-retaining CB opening | Electricity | 1 | Expired |
| US9951501B2 | Connection structure for plastic water channel main body of temperature regulating faucet | Fixed Constructions | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.