Francois Boedt
6Patents
1h-index
16Co-inventors
40Inventor score
Filing activity: Sep 4, 2007 → May 19, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7939427B2 | Process for fabricating a substrate of the silicon-on-insulator type with reduced roughness and uniform thickness | Electricity | 2 | Active |
| US9911641B2 | Process for manufacturing a semiconductor substrate, and semiconductor substrate obtained | Electricity | 1 | Active |
| US9190284B2 | Process for treating a semiconductor-on-insulator structure for improving thickness uniformity of the semiconductor layer | Electricity | 0 | Active |
| US9768057B2 | Method for transferring a layer from a single-crystal substrate | Electricity | 0 | Active |
| US9799549B2 | Process for manufacturing a composite structure | Electricity | 0 | Active |
| US9082819B2 | Process for thinning the active silicon layer of a substrate of “silicon on insulator” (SOI) type | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.