Frederik Otto
3Patents
1h-index
8Co-inventors
33Inventor score
Filing activity: Nov 17, 2015 → Feb 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9659793B2 | Method for producing a material-bonding connection between a semiconductor chip and a metal layer | Electricity | 2 | Active |
| US11329021B2 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Electricity | 0 | Active |
| US11581194B2 | Sintering method using a sacrificial layer on the backside metallization of a semiconductor die | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.