Gary Lam
8Patents
4h-index
36Co-inventors
57Inventor score
Filing activity: Dec 18, 2001 → Jul 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9005999B2 | Temperature control of chemical mechanical polishing | Electricity | 16 | Active |
| US11132602B1 | Efficient online training for machine learning | Physics | 9 | Active |
| US6780773B2 | Method of chemical mechanical polishing with high throughput and low dishing | Electricity | 7 | Expired |
| US6790768B2 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | Electricity | 6 | Expired |
| US6960521B2 | Method and apparatus for polishing metal and dielectric substrates | Electricity | 3 | Expired |
| US8930013B2 | Adaptively tracking spectrum features for endpoint detection | Performing Operations; Transporting | 2 | Active |
| US7232761B2 | Method of chemical mechanical polishing with high throughput and low dishing | Electricity | 0 | Expired |
| US12023779B2 | Post-chemical mechanical polishing brush cleaning box | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.